Please use this identifier to cite or link to this item: http://hdl.handle.net/123456789/6301
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dc.contributor.authorAmoako, G.-
dc.contributor.authorMensah, S. Y.-
dc.contributor.authorTwum, A.-
dc.contributor.authorTeye, V. D.-
dc.date.accessioned2021-10-28T11:35:20Z-
dc.date.available2021-10-28T11:35:20Z-
dc.date.issued2011-
dc.identifier.issn23105496-
dc.identifier.urihttp://hdl.handle.net/123456789/6301-
dc.description7p:, ill.en_US
dc.description.abstractGold/Polyimide interfaces are prepared by depositing thin gold films onto polyimide with Si substrates and subsequently annealing at various temperatures. The interface is studied with the help of Rutherford backscattering spectroscopy. After deposition, different sample thicknesses exhibited different morphologies. High deposition rates resulted in the formation of gold islands. After annealing at higher temperatures polyimide covered the sample surface. Chromium was also used as a buffer between gold/polyimide interface to increase adhesion and possibly to decrease the tendency of gold to form islands and also to stop polyimide from covering the gold surface. To reduce the mobility of metal atoms, a gold film is prepared at -68 0 Cen_US
dc.language.isoenen_US
dc.publisherUniversity of Cape Coasten_US
dc.subjectAdhesionen_US
dc.subjectAnnealen_US
dc.subjectIn-diffusionen_US
dc.subjectMetalen_US
dc.subjectMobilityen_US
dc.subjectMorphologyen_US
dc.titleStability of gold thin films on polyimideen_US
dc.typeArticleen_US
Appears in Collections:Department of Physics

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